中国繁育最美蛇

WaPo: Ex-Austrian Foreign Minister Kneissl Left Country Due to 'Death Threats'_我的网站

一 |      8 月 25 日消息，科技媒体 Wccftech 昨日（8 月 24 日）发布博文，报道称英特尔披露了 Wildcat Lake（酷睿 Series 3）系列处理器的相关细节。    In a WhatsApp message, Kneissl wrote that she was “not giving interviews” and had to leave the country due to “death threats.”,On May 19, the European Parliament adopted a resolution demanding that former EU politicians resign from posts in Russian enterprises and called on the European Commission to sanction EU citizens in leadership positions in Russian entities or receiving money from Russia.,"[The European Parliament] notes that former politicians such as Esko Aho, Francois Fillon and Wolfgang Schussel have recently resigned from their positions in Russian firms and strongly demands that others, such as Karin Kneissl and Gerhard Schröder, do the same; further calls on the Council to extend the list of individuals targeted by EU sanctions to the European members of the boards of major Russian companies and to politicians who continue to receive Russian money," the text of the resolution read.,Kneissl has been criticized many times for her ties with Russia. Apart from her position as an independent director of Russia's Rosneft Board of Directors, which she had to quit on May 20, Kneissl's wedding in 2018 also sparked a scandal after Russian President Vladimir Putin attended the event. Apart from dancing with the bride, Putin shouted "Now a kiss!" in German, and signed his name across the newlyweds' car.,Karin Kneissl served as Austrian Foreign Minister between 2017 and 2019.。定位方面，英特尔 Wildcat Lake 主要面向入门级 PC，保留 Panther Lake 的基础架构，并通过封装、Die 面积、I/O 配置和优化主板设计降低平台成本。性能方面，Wildcat Lake 最高提供 40 TOPS 的平台 AI 算力，最高可达到 Raptor Lake U Refresh（酷睿 100 系列）的 2.7 倍；创作与生产力性能最高提升 2.1 倍，处理器功耗降低 64%。封装方案上，英特尔为降低封装成本和良率损失，Wildcat Lake 没有沿用 Panther Lake（酷睿 Ultra Series 3）的 Foveros 方案，改为使用有机多芯片封装（Multi-Chip Package，MCP）和 UCIe（Universal Chiplet Interconnect Express）方案。其中有机多芯片封装是一种将多个功能不同的裸芯片（Die）垂直堆叠或水平排列，共同封装在同一个有机基质载板（Organic Substrate）上的先进封装技术。而 UCIe 是半导体行业内的一个开源、标准化的芯粒（Chiplet）互连规范，定义了同一个封装内部（On-Package）不同芯片之间的通信标准，旨在打破过去的壁垒，让来自不同厂商、采用不同晶圆工艺节点的芯片能够像拼乐高积木一样，无缝地组装和协同工作。英特尔 Wildcat Lake 的计算 Die 采用 18A 工艺，I/O Die 采用台积电 N6 工艺。

二 | 18A 支持双裸片方案的 UCIe 连接。

三 | 这一变化也带来代价。UCIe 的凸点间距为 110 微米，Foveros 为 36 微米。更大的间距要求更高的 GT/s 速率，并扩大 I/O 与控制器区域，让 Wildcat Lake 的 UCIe Die 间接口面积比 Foveros 方案大 70%。与 Panther Lake 相比，Wildcat Lake 的计算 Die 面积缩小 38%。具体变化包括：Xe 图形核心最多 2 个，Panther Lake 为 4 个；保留用于 AI 的 XMX，取消光线追踪功能。

四 | NPU 减至最多 1 个，NPU 算力为 17 TOPS，平台总算力为 40 TOPS；Panther Lake 平台为 53 TOPS，NPU 为 3 个。P-Core 减至最多 2 个，Panther Lake 为 4 个；保留相同单线程性能，末级缓存从 12MB 减至 6MB。取消 IPU（图像处理单元）和用于摄像头的 USB 2 ISP。取消专业媒体功能。LP5 内存位宽从 128 位降至 64 位，系统缓存从 4MB 减至 2MB。

五 | 显示管线最多 3 条，Panther Lake 为 4 条；保留 4K 60Hz 和 UHBR20 支持。附上相关图片如下：。

Current article:http://93jw0g9.chuandanfozhuanbenglipaicuzi.pics/list_08zxtzz/hai8mba.html

Published on:02:29:41